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Your search returned 28 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components And Packaging Technologies
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Year : 2004 Volume number : 27 Issue: 01 |
Efficient Calculation Of Transient Temperature Fields Responding To Fast Changing Heatsoutces Over Long Duration In Power Electronic Systems
(Article)
Subject:
Dc-And Ac-Converter For Automotive
,
Multichip Modules
,
Integrated Starter-Generator
Author:
Y C
Gerstenmaier
Gerhard K. M.
Wachutka
page:
104
-
111
Infrared Detection Of Delaminations Using Induction Heating
(Article)
Subject:
Adhesion
,
Excitation
,
Infrared
,
Thermal Management
Author:
Zbigniew
Suszynski
Robert
Arsoba
page:
112
-
116
Synthesis Of Thermal Rc-Networks For System-In-Packages
(Article)
Subject:
Compact Model
,
Thermal Characteristics
,
Thermal Modeling
Author:
Vesa
Kyyhkynen
page:
117
-
123
The Effects Of Material Transfer In Relays Diagnosed By Force And/Or Voltage Measurement
(Article)
Subject:
Electrical Contact
,
Relays
,
Material Tests
Author:
Martin
Hammerschmidt
Alexander R.
Neuhaus
page:
12
-
18
Studies On The Nonlinearity Effects In Dynamic Compact Model Generation Of Packages
(Article)
Subject:
Compact Thermal Model
,
Temperature Dependent
,
Model
,
Dynamic Compaction
Author:
Marta
Rencz
Vladimir
Szekely
page:
124
-
130
Vacuum Heated Electroless Nickel Plated Contacts
(Article)
Subject:
Connectors
,
Corrosion Resistance
,
High Manganese Steel
Author:
Constantine T.
Dervos
C.
Kollia
page:
131
-
137
Computation Of Natural Convection In Channels With Pin Fins
(Article)
Subject:
Channel Identification
,
Rayleigh Fading
,
Pin
,
Nusselt Numbers
Author:
Dhanunjay S.
Boyalakuntla
Jayathi Y.
Murthy
Cristina H.
Amon
page:
138
-
146
Cooling Rate In Diode Laser Bonding
(Article)
Subject:
Au-Sn
,
Bonding
,
Strain
,
Solder Ball Reliability
Author:
Mark A.
Fritz
Daniet T.
Csssidy
page:
147
-
145
Wire-Bond Void Formation During High Temperature Aging
(Article)
Subject:
Electronic Packaging
,
Reliability
,
Wire Bonding
Author:
Hen
Chang
Ker-Chang
Hsieh
Albert
Yang
page:
155
-
160
Failure Mechanism Of Anisotropic Conductive Adhesive Interconnections In Flip Ics On Flexible Substates
(Article)
Subject:
Conductive Contrete
,
Endurance
Author:
J. De
Vries
page:
161
-
166
Voltage-Current Characteristics Of Breaking Arc At Cinstant Opening Speed In The Air
(Article)
Subject:
Arc Discharge
,
Minimum Amount Of Time
,
Relay
,
Switching Activity
Author:
Junya
Sekikawa
Takayoshi
Kubono
page:
167
-
171
Exothermic Reaction Induced Eutectic Pb-Sn Solder Ball Melting In The Underfill Curing Process
(Article)
Subject:
Exotherm
,
Flip Chip
,
Solder Ball Reliability
Author:
Woon-Seong
Kwon
Se-Young
Jang
Kyung-Wook
Paik
page:
172
-
174
A Fluxless Process Of Producing Tin-Rich Gold -Tin Joints In Air
(Article)
Subject:
Lead-Free Solder
,
Intermetallics
,
Gold-Catalyzed
Author:
Ricky W.
Chuang
Dongwook
Kim
page:
177
-
181
Package To Board Interconnection Shear Strength Pbiss Effect Of Sutface Finish , Pwb Build-Up Layer And Chip Scale Package Structure
(Article)
Subject:
Aramid
,
Black Sea
,
Portable Generator
,
Quality
Author:
Sridhar
Canumalla
Hee-Dong
Yang
Puligandla
Viswanadham
page:
182
-
190
Ruthenium And Tungsten As Contact Materials In Hermetically Plastic Sealed Telecom And Signal-Relays
(Article)
Subject:
Contact Material
,
Tungsten
,
Telecommuting
Author:
Werner
Johler
page:
19
-
29
Analysis Of A Phase Change Energy Storage System For Pulsed Power Dissipation
(Article)
Subject:
Electronics
,
Phase Change
,
Pulsed Power System
Author:
Shankar
Krishnan
Suresh V.
Garimella
page:
191
-
199
Three-Dimensional Modeling Of Mold Filling In Microelectronics Encapsulation Process
(Article)
Subject:
Finite Volume
,
Ic Packages
,
Vof
,
Transfer Mode
Author:
Rong-Chong
Chang
Wen-Hsien
Yang
page:
200
-
209
Thermal Assessmaent Of Glass-Metal Composition Plasma Displauy Planels Using Design Of Experiments
(Article)
Subject:
Plasma
,
Reliability
,
Thermal Annealing
Author:
Mikyoung
Lee
Michael G.
Pecht
page:
210
-
216
Impact Of Lead-Free Soldering Processes On The Performance Of Signal Relay Contacts
(Article)
Subject:
Contact Area
,
Whisker Growth
,
Telecom And Datacom
Author:
Wener
Johler
page:
30
-
41
Influednce Of Electrical And Mechanical Parameters On Contact Welding In Low Power Switches
(Article)
Subject:
Arc Duration
,
Kinetics
,
Impact Velocity
Author:
L.
Neuhaus
Werner
Rieder
page:
4
-
11
Gassing Arc Chamber Wall Material Effect On Post Current-Zero Recovery Voltage Breakdown
(Article)
Subject:
Arcing
,
Breakdown
,
Recovery
Author:
John J.
Shea
page:
42
-
50
The Energeticsof Gas Flow And Contact Erosion During Short Circuit Arcing
(Article)
Subject:
Gas Flow
,
Contact Element
,
Arc Chamber
Author:
P. M.
Weaver
Kesorn
Pechrach
John W.
Mcbride
page:
51
-
56
Disengaging Connectors Under Automotive 42-Vdc Loads
(Article)
Subject:
Arc Chamber
,
Bulk Microstructure
,
Bulk Data
Author:
Paul M.
Weaver
John W.
Mcbride
page:
57
-
64
Vibration Thresholds For Fretting Corrosion In Electrical Connectors
(Article)
Subject:
Dynamic Response
,
Fretting Fatigue
,
Vibration Sensor
Author:
George T.
Flowers
Fei
Xie
Robert D.
Malucei
page:
65
-
71
Effect Of Connector Design On The Performance Of Service Power Connectors
(Article)
Subject:
Conductor Connector Interface
,
Wedge-Shaped
,
Saline Landfill Leachates
Author:
Milenko
Braunovic
page:
72
-
78
Sources Of Variation In Piezoresistive Stress Sensor Measurements
(Article)
Subject:
Piezoresistance Coefficients
,
Stress Slip
Author:
Orla
Slattery
Denis O'
Mahoney
page:
81
-
86
Analytical Multipoint Moment Matching Reduction Of Distributed Thermal Networks
(Article)
Subject:
Multipoint Moment Matching
,
Model Order Selection
,
Distributed Delay
Author:
L
Codecasa
Paolo
Maffezzoni
Dario D'
Amore
page:
87
-
95
Compact Thermal Networks For Modeling Packages
(Article)
Subject:
Ball Grid Arrays
,
Modeling
,
Packaging
Author:
L
Codecasa
Dario D'
Amore
Paolo
Maffezzoni
page:
96
-
103
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